18A
Business
Intel Reports High-NA EUV Milestone and Packaging Lead, Also Overhauls Technical Ladder
Intel says it has processed one million wafers using High-NA EUV lithography and is drawing praise for its EMIB-T packaging technology, while separately renaming its longstanding 'Fellow' title to 'Distinguished Engineer.'
3 outletsHardwareIntel Details How UCIe Interconnect Made Its Budget Wildcat Lake Chip Possible
At Hot Chips 2026, Intel explained how it used the UCIe open chiplet standard instead of its advanced Foveros packaging to build Wildcat Lake, a budget laptop chip that pairs its cutting-edge 18A node with aggressive cost cuts elsewhere in the design.
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